Signal integrity and EMC in high-speed electronic package integration

被引：0
|
作者：
Li, E. P. [1 ]
机构：
[1] Natl Univ Singapore, ASTAR Inst High Performance Comp, Singapore, Singapore
来源：
2007 ASIA-PACIFIC CONFERENCE ON APPLIED ELECTROMAGNETICS, PROCEEDINGS | 2007年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The increase in functionality and decrease in size of modern electronic products have resulted in the wide applications of high-performance packages using multilayer substrates. The analysis of electrical property including signal integrity and EMI is still the key challenge for such complex package structure. A novel method for system-level modeling of advanced electronic packages is presented which is able to provide fast yet accurate simulation for signal and power integrity analysis of the multilayered electronic packages. The method is a semi- numerical approach based on the combination of the moment method and the scattering matrix method.
引用
收藏
页码：7 / 10
页数：4
相关论文
共 50 条
  • [1] Ensuring Signal and Power Integrity for High-Speed Digital Systems An EMC Perspective
    Schuster, Christian
    2015 IEEE 5TH INTERNATIONAL CONFERENCE ON CONSUMER ELECTRONICS - BERLIN (ICCE-BERLIN), 2015, : 205 - 207
  • [2] Concurrent analysis of signal-power integrity and EMC for high-speed signaling systems
    Chan, Edward K.
    Lai, Mauro
    Choi, Myoung Joon
    Ryu, Woong Hwari
    2007 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY: WORKSHOP AND TUTORIAL NOTES, VOLS 1-3, 2007, : 77 - 84
  • [3] Advanced Parallel Algorithm for System-Level EMC Modeling of High-Speed Electronic Package
    Li, Er-Ping
    Wei, X. C.
    Liu, En-Xiao
    Oo, Zaw Zaw
    2008 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1-3, 2008, : 763 - 767
  • [4] The Signal Integrity of The High-speed IC Design
    Huang, Kaer
    Liu, Wenyi
    Zhang, Yan
    Yan, Hongcheng
    2010 6TH INTERNATIONAL CONFERENCE ON WIRELESS COMMUNICATIONS NETWORKING AND MOBILE COMPUTING (WICOM), 2010,
  • [5] Ensuring signal integrity in high-speed connectors
    Witte, Markus
    CONNECTOR SPECIFIER, 2009, 25 (01) : 12 - +
  • [6] Signal Integrity Characterization of High-Speed DDR Interface
    Kato, Takuya
    Yamamoto, Shintaro
    Sudo, Toshio
    Ono, Yasushi
    Takahashi, Eiji
    Yamada, Toru
    2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2011,
  • [7] Signal Integrity Analysis and Simulation of High-speed Circuit
    Zhu Xiaoyan
    Wang Zhao
    PROCEEDINGS 2016 EIGHTH INTERNATIONAL CONFERENCE ON MEASURING TECHNOLOGY AND MECHATRONICS AUTOMATION ICMTMA 2016, 2016, : 593 - 596
  • [8] CLOCK AND SIGNAL INTEGRITY FOR TESTING HIGH-SPEED ADCS
    Okawara, Hideo
    ELECTRONICS WORLD, 2011, 117 (1908): : 14 - 17
  • [9] High-Speed Signal Integrity Design for HDCA Systems
    Kwon, Wonok
    Kim, Young Woo
    2018 INTERNATIONAL CONFERENCE ON INFORMATION AND COMMUNICATION TECHNOLOGY CONVERGENCE (ICTC), 2018, : 1267 - 1269
  • [10] Method for System-Level Signal and Power Integrity Modeling of High-Speed Electronic Packages
    Liu, En-Xiao
    Wei, Xingchang
    Oo, Zaw Zaw
    Zhang, Yao-Jiang
    Zhang, Wenzu
    Li, Er-Ping
    2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, : 96 - 101
12345