Congruences between Siegel modular forms II

被引：1

作者：

Ichikawa, Takashi ^{[1
]}

机构：

[1] Saga Univ, Dept Math, Fac Sci & Engn, Saga 8408502, Japan

来源：

JOURNAL OF NUMBER THEORY | 2013年 / 133卷 / 04期

关键词：

Siegel modular forms; Moduli spaces;

D O I：

10.1016/j.jnt.2012.09.014

中图分类号：

O1 [数学];

学科分类号：

0701 ; 070101 ;

摘要：

Using a p-adic monodromy theorem on the affine ordinary locus in the minimally compactified moduli scheme modulo powers of a prime p of abelian varieties, we extend Katz's results on congruence and p-adic properties of elliptic modular forms to Siegel modular forms of higher degree. (C) 2012 Elsevier Inc. All rights reserved.

引用

页码：1362 / 1371

页数：10

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