Congruences between Siegel modular forms II

被引：1
|
作者：
Ichikawa, Takashi [1 ]
机构：
[1] Saga Univ, Dept Math, Fac Sci & Engn, Saga 8408502, Japan
来源：
JOURNAL OF NUMBER THEORY | 2013年 / 133卷 / 04期
关键词：
Siegel modular forms; Moduli spaces;
D O I：
10.1016/j.jnt.2012.09.014
中图分类号：
O1 [数学];
学科分类号：
0701 ; 070101 ;
摘要：
Using a p-adic monodromy theorem on the affine ordinary locus in the minimally compactified moduli scheme modulo powers of a prime p of abelian varieties, we extend Katz's results on congruence and p-adic properties of elliptic modular forms to Siegel modular forms of higher degree. (C) 2012 Elsevier Inc. All rights reserved.
引用
收藏
页码：1362 / 1371
页数：10
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