Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review

被引：55

作者：

Zhang, Peng ^{[1
]}

Xue, Songbai ^{[1
]}

Wang, Jianhao ^{[1
]}

Xue, Peng ^{[2
]}

Zhong, Sujuan ^{[3
]}

Long, Weimin ^{[3
]}

机构：

[1] Nanjing Univ Aeronaut & Astronaut, Coll Mat Sci & Technol, Nanjing 210016, Peoples R China

[2] Nanjing Univ Sci & Technol, Sch Mat Sci & Engn, Nanjing 210096, Jiangsu, Peoples R China

[3] Zhengzhou Res Inst Mech Engn Co Ltd, State Key Lab Adv Brazing Filler Met & Technol, Zhengzhou 450002, Henan, Peoples R China

来源：

APPLIED SCIENCES-BASEL | 2019年 / 9卷 / 10期

基金：

中国国家自然科学基金;

关键词：

nanoparticle; composite lead-free solder; microstructure; mechanical properties; wettability; reliability; AG-CU SOLDER; INTERFACIAL INTERMETALLIC GROWTH; NANO-COMPOSITE SOLDERS; MECHANICAL-PROPERTIES; GRAPHENE NANOSHEETS; TENSILE PROPERTIES; INDIUM ADDITION; ZNO PARTICLES; IMC GROWTH; ELECTROMIGRATION;

D O I：

10.3390/app9102044

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve the microstructure and properties of lead-free solders. Therefore, the composite solders bearing nanoparticles have recently attracted wide attention. This article reviewed the recent research on SnAgCu, SnBi, and SnZn composite solder alloys and introduced the effect of nanoparticles on their microstructure, mechanical properties, wettability, and reliability. The mechanism of nanoparticles strengthening was analyzed and summarized. In addition, the shortcomings and future development trends of nanoparticle-reinforced lead-free solders were discussed, which is expected to provide some theoretical reference for the application of these composite solder in 3D IC package.

引用

页数：20

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