Development of Silicon Grating-to-Grating coupling technology and Demonstration of Fan-In/Fan-Out for Multi-Core Fiber applications

被引：0

作者：

Pashkova, Tatiana ^{[1
]}

O'Brien, Peter ^{[1
]}

机构：

[1] Tyndall Natl Inst, Photon Packaging Grp, Cork, Ireland

来源：

2019 IEEE 21ST ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) | 2019年

关键词：

HIGH-EFFICIENCY; COUPLERS; TRANSMISSION;

D O I：

10.1109/eptc47984.2019.9026667

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Motivated by the potential applications of the multicore fibers (MCFs), we presented a compact solution for dense on-chip interconnects utilizing grating-to-grating coupling technology. In this work, we designed, fabricated and performed measurements of compact chip-based fan-in/fan-out structures fabricated on a silicon chip. We demonstrated a miniaturized chip-based component that can be applicable as an interposer for coupling light from 7-core MCF to individual channels on chip or as a chip-to-chip link between photonic integrated circuits (PICs).

引用

页码：582 / 585

页数：4

共 49 条

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