Through-thickness texture gradient of tantalum sputtering target

被引：6
|
作者：
Deng, Chao [1 ]
Liu, Shi-Feng [1 ]
Hao, Xiao-Bo [1 ]
Ji, Jing-Li [1 ]
Liu, Qing [1 ]
Fan, Hai-Yang [1 ]
机构：
[1] Chongqing Univ, Coll Mat Sci & Engn, Chongqing 400044, Peoples R China
来源：
RARE METALS | 2017年 / 36卷 / 06期
基金：
中国国家自然科学基金;
关键词：
Recrystallization; Texture; Tantalum sputtering target; Electron backscatter diffraction; DIFFUSION BARRIER; MECHANICAL-PROPERTIES; COPPER; CU; MICROSTRUCTURE; METALLIZATION; SILICON; ALLOY;
D O I：
10.1007/s12598-014-0407-z
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
For sputtering targets, through-thickness texture is critical for assuring reliable sputtering performance. In this paper, through-thickness texture gradient of a rolled and subsequently annealed tantalum sputtering target was investigated. The results show that by carefully controlling the rolling process, shear-related components at the surface of the rolled sample could be avoided. Both the rolled sample and the annealed target develop a through-thickness texture gradient with the formation of a stronger {1 1 1} fiber in the center layer compared with that in the surface layer.
引用
收藏
页码：523 / 526
页数：4
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