A reliability growth model for modular software

被引：0

作者：

Okamura, H ^{[1
]}

Kuroki, S

Dohi, T

Osaki, S

机构：

[1] Hiroshima Univ, Dept Informat Engn, Hiroshima 7398527, Japan

[2] IBM Japan Ltd, Tokyo 1068711, Japan

[3] Nanzan Univ, Fac Math Sci & Informat Engn, Seto 4890863, Japan

来源：

ELECTRONICS AND COMMUNICATIONS IN JAPAN PART II-ELECTRONICS | 2004年 / 87卷 / 05期

关键词：

software modules; software reliability; software architecture; Markov processes; reliability growth;

D O I：

10.1002/ecjb.20075

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a probabilistic model for evaluating the reliability of software having modular structure. In particular, it proposes a new reliability-evaluating model based on the structure of software by integrating the Jelin-ski-Moranda model, which is the most basic black box model, and the Littlewood model, which is a representative white box model. The performance of the proposed model is compared and studied in reference to the benchmark model of Cheung and the. dependency of the architecture and the reliability growth in software reliability evaluation is discussed. (C) 2004 Wiley Periodicals, Inc.

引用

页码：43 / 53

页数：11

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