Microstructure Evolution of 1100 Al Alloy Multi-foils during Ultrasonic Additive Manufacturing

被引：0

作者：

Ji, Hongjun ^{[1
]}

Wang, Junzhao ^{[1
]}

Li, Mingyu ^{[1
]}

机构：

[1] Harbin Inst Technol, Shenzhen Grad Sch, Shenzhen Key Lab Adv Mat, Shenzhen, Peoples R China

来源：

2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) | 2012年

关键词：

ELECTRON BACKSCATTER DIFFRACTION; CONSOLIDATION;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Multi-annealed 1100 Al alloy foils were welded to form monolithic samples using the ultrasonic additive manufacturing (UAM) process at room temperature. 40%, 60%, 80% of the oscillation amplitudes were investigated at 20 kHz frequency and a constant contact pressure. Deformed microstructures were analyzed using low-resolution electron backscattered diffraction (EBSD). Evolution of fine equiaxed grains from an initial coarser grain structure was observed in the volume of AI alloy foils, and the extent of the grain refinement is proportion to oscillation amplitude. Additionally, the orientation image maps (OIM), polar figures (PF), and orientation distribution functions (ODF) of the samples are obtained. The characteristics of the crystallographic orientation were analyzed to find the effect of ultrasonic amplitude on the microtexture of the matrix material.

引用

页码：1586 / 1589

页数：4

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