Design-Technology Co-Optimization for NVM-Based Neuromorphic Processing Elements

被引:3
|
作者
Song, Shihao [1 ]
Balaji, Adarsha [1 ]
Das, Anup [1 ]
Kandasamy, Nagarajan [1 ]
机构
[1] Drexel Univ, 3141 Chestnut St, Philadelphia, PA 19104 USA
基金
美国国家科学基金会;
关键词
Neuromorphic computing; design-technology co-optimization (DTCO); non-volatile memory (NVM); oxide-based resistive random access memory (OxRRAM); SPIKING NEURAL-NETWORKS; COMPUTING SYSTEM; TRADE-OFFS; FRAMEWORK; INFERENCE; LIFETIME; COMPACT; NEURONS;
D O I
10.1145/3524068
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
An emerging use case of machine learning (ML) is to train a model on a high-performance system and deploy the trained model on energy-constrained embedded systems. Neuromorphic hardware platforms, which operate on principles of the biological brain, can significantly lower the energy overhead of an ML inference task, making these platforms an attractive solution for embedded ML systems. We present a design-technology tradeoff analysis to implement such inference tasks on the processing elements (PEs) of a non-volatile memory (NVM)-based neuromorphic hardware. Through detailed circuit-level simulations at scaled process technology nodes, we show the negative impact of technology scaling on the information-processing latency, which impacts the quality of service of an embedded ML system. At a finer granularity, the latency inside a PE depends on (1) the delay introduced by parasitic components on its current paths, and (2) the varying delay to sense different resistance states of its NVM cells. Based on these two observations, we make the following three contributions. First, on the technology front, we propose an optimization scheme where the NVM resistance state that takes the longest time to sense is set on current paths having the least delay, and vice versa, reducing the average PE latency, which improves the quality of service. Second, on the architecture front, we introduce isolation transistors within each PE to partition it into regions that can be individually power-gated, reducing both latency and energy. Finally, on the system-software front, we propose a mechanism to leverage the proposed technological and architectural enhancements when implementing an ML inference task on neuromorphic PEs of the hardware. Evaluations with a recent neuromorphic hardware architecture show that our proposed design-technology co-optimization approach improves both performance and energy efficiency of ML inference tasks without incurring high cost-per-bit.
引用
收藏
页数:27
相关论文
共 50 条
  • [1] Design-Technology Co-optimization for Cryogenic Tensor Processing Unit
    Kang, Dong Suk
    Yu, Shimeng
    [J]. 2022 IEEE ASIA PACIFIC CONFERENCE ON CIRCUITS AND SYSTEMS, APCCAS, 2022, : 1 - 4
  • [2] Design-Technology Co-Optimization for OxRRAM-based synaptic processing unit
    Mallik, A.
    Garbin, D.
    Fantini, A.
    Rodopoulos, D.
    Degraeve, R.
    Stuijt, J.
    Das, A. K.
    Schaafsma, S.
    Debacker, P.
    Donadio, G.
    Hody, H.
    Goux, L.
    Kar, G. S.
    Furnemont, A.
    Mocuta, A.
    Raghavan, P.
    [J]. 2017 SYMPOSIUM ON VLSI TECHNOLOGY, 2017, : T178 - T179
  • [3] Ab Initio for Design-Technology Co-Optimization
    Aboud, Shela J.
    Huang, Joanne
    Cobb, Jonathan
    Gunst, Tue
    Asenov, Plamen
    Dam, Thuc
    Borges, Ricardo
    [J]. DESIGN-PROCESS-TECHNOLOGY CO-OPTIMIZATION XV, 2021, 11614
  • [4] The Past, Present, and Future of Design-Technology Co-Optimization
    Yeric, Greg
    Cline, Brian
    Sinha, Saurabh
    Pietromonaco, David
    Chandra, Vikas
    Aitken, Rob
    [J]. 2013 IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE (CICC), 2013,
  • [5] Demonstrating the Benefits of Template-based Design-technology Co-optimization
    Liebmann, Lars
    Hibbeler, Jason
    Hieter, Nathaniel
    Pileggi, Larry
    Jhaveri, Tejas
    Moe, Matthew
    Rovner, Vyacheslav
    [J]. DESIGN FOR MANUFACTURABILITY THROUGH DESIGN-PROCESS INTEGRATION IV, 2010, 7641
  • [6] Design-Technology Co-Optimization for Reliability and Quality in Advanced Nodes
    Shroff, Mehul D.
    Loke, Alvin L. S.
    [J]. DESIGN-PROCESS-TECHNOLOGY CO-OPTIMIZATION XV, 2021, 11614
  • [7] Density Aware Cell Library Design for Design-Technology Co-Optimization
    Nishizawa, Shinichi
    Nakura, Toru
    [J]. PROCEEDINGS OF THE TWENTY THIRD INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN (ISQED 2022), 2022, : 261 - 261
  • [8] Design-technology co-optimization for 2D electronics
    Zhu, Jiadi
    Palacios, Tomas
    [J]. NATURE ELECTRONICS, 2023, 6 (11) : 803 - 804
  • [9] Interconnect Design-Technology Co-Optimization for Sub-3nm Technology Nodes
    Baert, Rogier
    Ciofi, Ivan
    Patli, Sudhir
    Zografos, Odysseas
    Sarkar, Satadru
    Chehab, Bilal
    Jang, Doyoung
    Spessot, Alessio
    Ryckaert, Julien
    Tokei, Zsolt
    [J]. 2020 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC), 2020, : 28 - 30
  • [10] Design-Technology Co-Optimization with Standard Cell Layout Generator for Pin Configurations
    Yoon, Junghyun
    Park, Heechun
    [J]. 2024 25TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, ISQED 2024, 2024,