Angular-Shaped Boron Nitride Nanosheets with a High Aspect Ratio to Improve the Out-of-Plane Thermal Conductivity of Polyimide Films

Polyimide/boron nitride nanosheet (PI/BNNS) composite films have potential applications in the field of electrical devices due to the superior thermal conductivity and outstanding insulating properties of the boron nitride nanosheet. In this study, the boron nitride nanosheet (BNNS-t) was prepared by the template method using sodium chloride as the template, and B2O3 and flowing ammonia as the boron and nitrogen sources, respectively. Then, the PI/ BNNS-t composite films were investigated with different loading of BNNS-t as thermally conductive fillers. The results show that BNNS-t has a high aspect ratio and a uniform lateral dimension, with a large dimension and a thin thickness, and there are a few nanosheets with angular shapes in the as-obtained BNNS-t. The synergistic effect of the above characteristics for BNNS-t is beneficial to constructing the three-dimensional heat conduction network of the PI/BNNS-t composite films, which can significantly improve the out-of-plane thermal conduction properties. And then, the out-of-plane thermal conductivity of the PI/BNNS-t composite film achieves 0.67 W m-1 K-1 at 40% loading, which is nearly 3.5 times that of the PI film.