Progress in direct-current plasma immersion ion implantation and recent applications of plasma immersion ion implantation and deposition

被引:19
|
作者
Chu, Paul K. [1 ]
机构
[1] City Univ Hong Kong, Dept Phys & Mat Sci, Kowloon, Hong Kong, Peoples R China
来源
关键词
Plasma immersion ion implantation and deposition; Biomaterials; Ti-based alloys; Biomedical polymers; SHAPE-MEMORY ALLOYS; SURFACE MODIFICATION; CORROSION-RESISTANCE; MECHANICAL-PROPERTIES; CELL-ADHESION; PROTEIN ADSORPTION; HUMAN OSTEOBLASTS; MAGNESIUM; NITROGEN; BEHAVIOR;
D O I
10.1016/j.surfcoat.2012.03.073
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Plasma immersion ion implantation and deposition (PIII&D) has been used extensively in microelectronics and metallurgical engineering and its future in biomedical engineering and nanotechnology is even brighter with many novel and burgeoning applications. In this invited review, recent work conducted in the Plasma Laboratory at City University of Hong Kong is described. Advances in direct-current plasma immersion ion implantation, especially non-contact printing and implantation into 3-dimensional components, are discussed. Examples of new applications include fabrication and biological properties of plasma-modified titanium-based materials and control of the surface degradation rate and other properties of biodegradable polymeric and metallic materials. (C) 2012 Elsevier B.V. All rights reserved.
引用
收藏
页码:2 / 11
页数:10
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