Residual Stress Determination by X-Ray Diffraction with Stress of Two Directions Analysis Method

被引：1

作者：

Feng, Aixin ^{[1
]}

Sun, Huaiyang ^{[1
]}

Cao, Yupeng ^{[1
]}

Xu, Chuanchao ^{[1
]}

Nie, Guifeng ^{[1
]}

Wang, Junwei ^{[1
]}

Zhou, Pengcheng ^{[1
]}

机构：

[1] Jiangsu Univ, Sch Mech Engn, Laser Technol Inst, Zhenjiang, Peoples R China

来源：

ADVANCES IN MECHATRONICS TECHNOLOGY | 2011年 / 43卷

关键词：

X-ray diffraction; stress of two directions analysis method; residual stress; calculation;

D O I：

10.4028/www.scientific.net/AMM.43.569

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Residual stress determination by X-ray diffraction is theoretically analyzed. Using stress of two directions analysis method, the magnitude and direction of the principal stress which is induced by laser shocked wave can be calculated. The results indicate that the calculated value consists with that of the experimental data, which shows that the surface stresses state comprehensively. Meanwhile, the relationship between the principle stress and single stress with different energies are analyzed.

引用

页码：569 / 572

页数：4

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