Thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites

被引：16

作者：

Yu, Seunggun ^{[1
,2
]}

Kim, Do-Kyun ^{[2
]}

Park, Cheolmin ^{[1
]}

Hong, Soon Man ^{[2
]}

Koo, Chong Min ^{[2
,3
]}

机构：

[1] Yonsei Univ, Dept Mat Sci & Engn, Seoul 120749, South Korea

[2] Korea Inst Sci & Technol, Inst Multidisciplinary Convergence Mat, Ctr Mat Architecturing, Seoul 136791, South Korea

[3] Univ Sci & Technol, Taejon 305350, South Korea

来源：

RESEARCH ON CHEMICAL INTERMEDIATES | 2014年 / 40卷 / 01期

关键词：

Thermal conductivity; Nylon 6,6; Silicon carbide; Boron nitride; Composites; NANOCOMPOSITES; NANOPLATELET; PERFORMANCE;

D O I：

10.1007/s11164-013-1452-1

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

A study was performed to determine the effect of the content and orientation of fillers on the thermal conductivity of a polymeric composite packed with hexagonal boron nitride (hBN) and silicon carbide (SiC) fillers. The thermal conductivity behavior of SiC-Nylon 6,6 and hBN-Nylon 6,6 composites was more dependent on the orientation and shape of the filler than on its thermal conductivity. The thermal conductivity of SiC-Nylon 6,6 composites with 59 % (v/v) isotropic SiC fillers increased from 0.25 to 3.83 W/m K. That of hBN-Nylon 6,6 composites with 62 % (v/v) anisotropic hBN fillers increased from 0.25 to 2.16 W/m K in the perpendicular direction whereas in the parallel direction it increased rapidly to 8.55 W/m K.

引用

页码：33 / 40

页数：8

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