A modular environment for the design of micromachined silicon devices

被引:0
|
作者
Steffensen, L
Than, O
Buttgenbach, S
机构
关键词
CAD; 3D modelling; CAD environment; product model; etch simulation; FEM;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper reports on a modular environment for the design of micromachined silicon devices which is based on a 3D simulation module for silicon anisotropic etching. The simulation data are processed into an adequate volume representation that meets the geometrical requirements of finite element modelling tools. The design environment uses an object-oriented geometric modelling interface serving as the basis of a product model which centrally stores the data of the whole design process. The paper concludes with an example that illustrates the design process.
引用
收藏
页码:1023 / 1026
页数:4
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