Effect of the ionic strength and the electrolyte composition on the suppression of copper deposition by PEG

被引：7
|
作者：
Atanasova, T. A. [1 ,2 ]
Strubbe, K. [2 ]
Vereecken, P. M. [1 ,3 ]
机构：
[1] IMEC, Kapeldreef 75, B-3001 Louvain, Belgium
[2] Univ Ghent, Dept Inorgan & Phys Chem, B-9000 Ghent, Belgium
[3] Katholieke Univ Leuven, Ctr Surface Chem & Catalysis, B-3001 Leuven, Belgium
来源：
FUNDAMENTALS OF ELECTROCHEMICAL GROWTH: FROM UPD TO MICROSTRUCTURES - SYMPOSIUM IN MEMORY OF PROF. EVGENI BUDEVSKI | 2010年 / 25卷 / 34期
关键词：
ELECTRODEPOSITION;
D O I：
10.1149/1.3335493
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
The acid copper sulfate solutions used for Damascene plating contain several additives which provide the differential kinetics inside cavities for void-free fill. Although the synergetic effects between these additives were studied quite thoroughly for the last 2 decades, the underlying mechanisms are still not fully understood. In this work we provide some further insight into the physicochemical mechanism of copper deposition inhibition by the suppressor polymer. The quantitative participation of each solution component in the formation of Cu(I)-Suppressor-Cl complex is examined. In addition, our experiments show that ionic strength has a profound effect on the adsorption/desorption mechanism.
引用
收藏
页码：67 / 78
页数：12
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