MicroLens/UV-LED Array Packaging for Dynamic and Static Alignment

被引：0
|
作者：
Luetzeschwab, M. [1 ]
Desmulliez, M. P. Y. [1 ]
Weiland, D. [2 ]
机构：
[1] Heriot Watt Univ, Microsyst Engn Ctr, Earl Mountbatten Bldg, Edinburgh EH14 4AS, Midlothian, Scotland
[2] Alba Ctr, Inst Syst Level Integrat, Livingston, Scotland
来源：
ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2008年
基金：
英国工程与自然科学研究理事会;
关键词：
D O I：
10.1109/ESTC.2008.4684509
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
This paper presents a fully integrated packaging solution that permits the static and active alignment of a microLens array placed on top of a micro-UV-LED array. The entire process is manufactured by UV-Iithography using predominantly the photoresists SU8 and THB. The processing temperature for all steps is below 120 degrees C.
引用
收藏
页码：1121 / +
页数：2
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