Effect of rare earth Ce on the thermal behavior, microstructure and mechanical properties of Zn-30Sn-2Cu high temperature lead-free solder alloy

被引：10
|
作者：
Zeng, Xianwei [1 ]
Liu, Yichi [1 ]
Zhang, Jiankang [2 ]
Liu, Yi [2 ]
Hu, Xiaowu [1 ]
Jiang, Xiongxin [1 ]
机构：
[1] Nanchang Univ, Sch Mech & Elect Engn, Nanchang 330031, Jiangxi, Peoples R China
[2] Sino Platinum Met Co Ltd, State Key Lab Adv Technol Comprehens Utilizat Pla, Kunming 650106, Yunnan, Peoples R China
来源：
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS | 2020年 / 31卷 / 19期
基金：
中国国家自然科学基金;
关键词：
INTERFACIAL MICROSTRUCTURE; PART I; ZN; CU; EVOLUTION; NI; OPTIMIZATION; ADDITIONS; SNAGCU; SYSTEM;
D O I：
10.1007/s10854-020-04196-8
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The aim of the present study is to investigate the thermal behavior, microstructure and mechanical properties of high temperature Zn-30Sn-2Cu-xCe (x = 0, 0.05, 0.1, 0.5 wt%) Pb-free solders. The alloying of Ce refined the microstructure and increased the melting point of the solders. Zn-30Sn-2Cu-0.05Ce sample showed the best elongation, while the best ultimate tensile strength (UTS) and yield strength (YS) appeared in Zn-30Sn-2Cu-0.1Ce sample. The UTS of the alloys ranged from 44.02 to 64.95 MPa and the YS ranged from 32.73 to 51.83 MPa. Besides, the microhardness enhanced slightly with the addition of Ce. The analysis of the fractographies showed that the fracture mode turned from mixed brittle fracture into mixed ductile fracture with the addition of Ce.
引用
收藏
页码：16437 / 16447
页数：11
相关论文
共 50 条
  • [41] Influence of RE and Ni on Microstructure and Properties of Zn20Sn High -temperature Lead-Free Solder
    Li Xiaojun
    Tian Jun
    Dai Pinqiang
    Wang Haiyan
    RARE METAL MATERIALS AND ENGINEERING, 2018, 47 (06) : 1860 - 1865
  • [42] Enhancement of solder properties of Sn-9Zn lead-free solder alloy
    Kamal, M.
    Gouda, E. S.
    CRYSTAL RESEARCH AND TECHNOLOGY, 2006, 41 (12) : 1210 - 1213
  • [43] Thermal properties and phase stability of Zn-Sn and Zn-In alloys as high temperature lead-free solder
    Lee, Jae-Ean
    Kim, Keun-Soo
    Suganuma, Katsuaki
    Inoue, Masahiro
    Izuta, Goro
    MATERIALS TRANSACTIONS, 2007, 48 (03) : 584 - 593
  • [44] Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys
    C. M. L. Wu
    D. Q. Yu
    C. M. T. Law
    L. Wang
    Journal of Electronic Materials, 2002, 31 : 928 - 932
  • [45] Effect of Cerium on Properties of Sn-0.7Cu lead-free Solder Alloy
    Chen D.
    Teng Y.
    Bai H.
    Lü J.
    Xu F.
    Yan J.
    Zhongguo Xitu Xuebao/Journal of the Chinese Rare Earth Society, 2019, 37 (01): : 70 - 75
  • [46] Coupled effect of Ag and In addition on the microstructure and mechanical properties of Sn-Bi lead-free solder alloy
    Hu, Tianhan
    Li, Shun
    Li, Zhen
    Wu, Guanzhi
    Zhu, Ping
    Dong, Wufeng
    Sun, Yu
    Zhou, Jiayi
    Wu, Bingjia
    Zhao, Bingge
    Ding, Kai
    Gao, Yulai
    JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2023, 26 : 5902 - 5909
  • [47] Microstructure and mechanical properties of new lead-free Sn-Cu-RE solder alloys
    Wu, CML
    Yu, DQ
    Law, CMT
    Wang, L
    JOURNAL OF ELECTRONIC MATERIALS, 2002, 31 (09) : 928 - 932
  • [48] Effect of rare earth elements on lead-free solder microstructure evolution
    Pei, Min
    Qu, Jianmin
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 198 - +
  • [49] Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys
    Zhao Xiao-yan
    Zhao Mai-qun
    Cui Xiao-qing
    Xu Tian-han
    Tong Ming-xin
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2007, 17 (04) : 805 - 810
  • [50] Effect of cerium on microstructure and mechanical properties of Sn-Ag-Cu system lead-free solder alloys
    赵小艳
    赵麦群
    崔小清
    许天旱
    仝明信
    Transactions of Nonferrous Metals Society of China, 2007, (04) : 805 - 810
12345