Printed electronics: A merging of industries

被引：3
|
作者：
Harrop, Peter
机构：
来源：
PLASTICS ENGINEERING | 2007年 / 63卷 / 02期
关键词：
D O I：
10.1002/j.1941-9635.2007.tb00051.x
中图分类号：
TQ [化学工业];
学科分类号：
0817 ;
摘要：
引用
收藏
页码：28 / 33
页数：6
相关论文
共 50 条
  • [31] Printed electronics - the sky is the limit
    Harrop, Peter
    [J]. MICROELECTRONICS INTERNATIONAL, 2007, 24 (03) : 76 - 77
  • [32] Flexible and Printed Electronics FOREWORD
    Cho, Gyoujin
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS, 2018, 57 (05)
  • [33] Metal inks for printed electronics
    Belot, John
    McCullough, Richard D.
    [J]. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2010, 239
  • [34] Introduction to nanomaterials for printed electronics
    Casiraghi, Cinzia
    Jurchescu, Oana D.
    Magdassi, Shlomo
    Su, Wenming
    [J]. NANOSCALE, 2023, 15 (25) : 10480 - 10483
  • [35] Flexible and Printed Electronics FOREWORD
    Kitamura, Masatoshi
    Mori, Tatsuo
    [J]. JAPANESE JOURNAL OF APPLIED PHYSICS, 2022, 61 (SE)
  • [36] Enabling materials for printed electronics
    Wu, Yiliang
    Liu, Ping
    Li, Yuning
    Ong, Beng S.
    [J]. 2006 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2, 2006, : 434 - +
  • [37] ELECTRONICS A diverse printed future
    Rogers, John A.
    [J]. NATURE, 2010, 468 (7321) : 177 - 178
  • [38] Conductive nanomaterials for printed electronics
    [J]. Magdassi, S. (magdassi@cc.huji.ac.il), 1600, Wiley-VCH Verlag (10):
  • [39] Printed electronics for system application
    Pei, Z.
    Kung, C. P.
    Luo, P. Y.
    Chang, J. J.
    Chang, C. A.
    Huang, Stanley H.
    Chan, Y. J.
    [J]. 2006 INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY, SYSTEMS, AND APPLICATIONS (VLSI-TSA), PROCEEDINGS OF TECHNICAL PAPERS, 2006, : 74 - +
  • [40] Solderability and reliability of printed electronics
    Salam, B.
    Lok, B. K.
    [J]. IPFA 2008: PROCEEDINGS OF THE 15TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 2008, : 316 - 319
12345