Acoustic evaluation of the integrity of thin film structures

被引：0
|
作者：
Du, J [1 ]
Tittmann, BR [1 ]
机构：
[1] Penn State Univ, Dept Engn Sci & Mech, University Pk, PA 16802 USA
来源：
REVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION, VOLS 25A AND 25B | 2006年 / 820卷
基金：
美国国家科学基金会;
关键词：
thin film; layered structures; acoustic microscopy;
D O I：
暂无
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
This paper explores the potential offered by high frequency acoustic microscopy for nondestructive, qualitative and quantitative characterization of thin (micron and submicron) films. Wave propagation modeling in soft thin film samples shows that multiple modes of surface waves can exist in soft thin film structures. Interface weakness modeling indicates that surface wave velocities are sensitive to interface conditions and that different modes have different levels of sensitivity to bond strength. Our new acoustic microscope experimental system will be able to measure experimental dispersion curves, and measure the surface wave velocity as a function of frequency.
引用
收藏
页码：1090 / 1097
页数：8
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