Microstructures and Thermal Properties of Cold-Sprayed Cu-Cr Composite Coatings

Copper-based composites for thermal conductive components were prepared via the cold spray process, and the deposition efficiency and adhesion morphology of feedstock powders on Cu substrate were evaluated. Cu-based composites were fabricated using Cu-Cr mixed powders with their mixture ratio of 20, 35, 50, and 65 mass% Cr onto oxygen-free copper substrate with N-2 carrier gas. Cu-Cr composite coatings were investigated for their Cr content ratio, microstructures, and thermal conductivity. The Cr content ratio in the coating was approximately 50-60% of feedstock mixture ratio due to the low formability of the hard particles. Transmission electron microscopy characterizations revealed that an oxygen-rich layer exists at the Cr particle/Cu substrate interface, which contributes to the deposition of the Cr particles. After the heat treatment at 1093 K, the coatings showed denser cross-sectional structures than those before the heat treatment, and the thermal conductivity was improved as a result of the recrystallization of Cu matrix.