Fabrication of high precision microstructure using ICP etching for capacitive inclination sensor

被引:0
|
作者
Noda, Daiji [1 ]
Kuboyama, Yuu [1 ]
Hattori, Tadashi [1 ]
机构
[1] Univ Hyogo, Lab Adv Sci & Technol Ind, Kamigori, Hyogo 6781205, Japan
关键词
High Aspect Ratio; Micro Electro Mechanical System; Inclination Sensor; Inductively Couple Plasma Etching; Common Electrode;
D O I
10.1007/s00542-012-1548-3
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Capacitive inclination sensors have the advantage because it could easily provide a linear analog output with respect to inclination. Since the dimensions of the sensing region are very small, then this sensor is expected to be widely used in fields where efficient and reliable position control is a primary factor to be considered if this sensor could be mass produced at low cost. Therefore, we proposed fabrication process based on transfer to resin using mold. We successfully fabricated a micro capacitive inclination sensor by a combination of a resin forming method and a mold. The sensor consists of a gap distance of 80 mu m between its electrodes. The sensor detects difference of capacitance, which varied with movement of silicone oil accompanying with inclination. When the sensor was inclined, linear analog output was obtained within the range of -45 to +45A degrees.
引用
收藏
页码:309 / 313
页数:5
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