A Review of MEMS Vibrating Gyroscopes and Their Reliability Issues in Harsh Environments

被引:23
|
作者
Gill, Waqas Amin [1 ]
Howard, Ian [1 ]
Mazhar, Ilyas [1 ]
McKee, Kristoffer [1 ]
机构
[1] Curtin Univ, Dept Mech Engn, Perth, WA 6845, Australia
关键词
MEMS vibrating gyroscope; tuning fork; gimbal; vibrating ring; mode mismatch; frequency modulated; rate integrated; space applications; TUNING-FORK GYROSCOPE; DESIGN; SENSITIVITY; SENSOR; STABILITY; WHEEL;
D O I
10.3390/s22197405
中图分类号
O65 [分析化学];
学科分类号
070302 ; 081704 ;
摘要
Micro-electromechanical systems (MEMS) vibrating gyroscopes have gained a lot of attention over the last two decades because of their low power consumption, easy integration, and low fabrication cost. The usage of the gyroscope equipped with an inertial measurement unit has increased tremendously, with applications ranging from household devices to smart electronics to military equipment. However, reliability issues are still a concern when operating this inertial sensor in harsh environments, such as to control the movement and alignment of mini-satellites in space, tracking firefighters at an elevated temperature, and assisting aircraft navigation in gusty turbulent air. This review paper focuses on the key fundamentals of the MEMS vibrating gyroscopes, first discussing popular designs including the tuning fork, gimbal, vibrating ring, and multi-axis gyroscopes. It further investigates how bias stability, angle random walk, scale factor, and other performance parameters are affected in harsh environments and then discusses the reliability issues of the gyroscopes.
引用
收藏
页数:36
相关论文
共 50 条
  • [1] Design and Modelling of MEMS Vibrating Internal Ring Gyroscopes for Harsh Environments
    Gill, Waqas Amin
    Howard, Ian
    Mazhar, Ilyas
    Mckee, Kristoffer
    SENSORS, 2024, 24 (17)
  • [2] Reliability Testing Procedure for MEMS IMUs Applied to Vibrating Environments
    De Pasquale, Giorgio
    Soma, Aurelio
    SENSORS, 2010, 10 (01) : 456 - 474
  • [3] Reliability of vacuum packaged MEMS gyroscopes
    Choa, SH
    MICROELECTRONICS RELIABILITY, 2005, 45 (02) : 361 - 369
  • [4] MECHANICAL SHOCK RELIABILITY ANALYSIS AND MULTIPHYSICS MODELING OF MEMS ACCELEROMETERS IN HARSH ENVIRONMENTS
    Lall, Pradeep
    Kothari, Nakul
    Glover, Jessica
    INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 3, 2015,
  • [5] Silicon carbide MEMS for harsh environments
    Case Western Reserve Univ, Cleveland, United States
    Proc IEEE, 8 (1594-1610):
  • [6] MEMS and MOEMS Gyroscopes: A Review
    Huang, Wenyi
    Yan, Xing
    Zhang, Sengyu
    Li, Zhe
    Hassan, Jamal N. A.
    Chen, Dingwei
    Wen, Guangjun
    Chen, Kai
    Deng, Guangwei
    Huang, Yongjun
    PHOTONIC SENSORS, 2023, 13 (04)
  • [7] Silicon carbide MEMS for harsh environments
    Mehregany, M
    Zorman, CA
    Rajan, N
    Wu, CH
    PROCEEDINGS OF THE IEEE, 1998, 86 (08) : 1594 - 1610
  • [8] Packaging of MEMS and MOEMS for harsh environments
    Kaehler, Julian
    Stranz, Andrej
    Waag, Andreas
    Peiner, Erwin
    JOURNAL OF MICRO-NANOLITHOGRAPHY MEMS AND MOEMS, 2012, 11 (02):
  • [9] MEMS and MOEMS Gyroscopes: A Review
    Wenyi Huang
    Xing Yan
    Sengyu Zhang
    Zhe Li
    Jamal N. A. Hassan
    Dingwei Chen
    Guangjun Wen
    Kai Chen
    Guangwei Deng
    Yongjun Huang
    Photonic Sensors, 2023, 13
  • [10] Open loop Compensation of the Quadrature Error in MEMS Vibrating Gyroscopes
    Antonello, Riccardo
    Oboe, Roberto
    Prandi, Luciano
    Caminada, Carlo
    Biganzoli, Fabio
    IECON: 2009 35TH ANNUAL CONFERENCE OF IEEE INDUSTRIAL ELECTRONICS, VOLS 1-6, 2009, : 3833 - +