Packaging of MEMS and MOEMS for harsh environments

A method for die-attach based on sintering of micro-and nano-silver-particles, which is stable in harsh environments, was described. A modified flip-chip bonder providing high placement accuracy was used for precise pick and place die-attach. Components of sensors designed for data logging during deep drilling, i.e., a MEMS vibration sensor and a MOEMS pressure sensor, were assembled and tested at temperatures up to 250 degrees C. Shear tests of bonded devices were performed before and after temperature load. Bonded silicon-on-insulator Wheat-stone bridges and GaP-PD were tested by temperature cycling (50 cycles from 100 degrees C up to 250 degrees C). (C) 2012 Society of Photo-Optical Instrumentation Engineers (SPIE). [DOI: 10.1117/1.JMM.11.2.021202]