Thermal Performance of Heat Sink for Cooling High LED Power Applications

被引：0
|
作者：
Haraka, Fadwa [1 ]
El Ouatouati, Ahmad [1 ]
Taha Janan, Mourad [1 ]
机构：
[1] Mohammed V Univ, ENSET, Lab Mech & Ind Proc, Rabat, Morocco
来源：
PROCEEDINGS OF 2016 INTERNATIONAL RENEWABLE & SUSTAINABLE ENERGY CONFERENCE (IRSEC' 16) | 2016年
关键词：
Thermal resistance; High LED power; Thermal spreading resistance; 3D Finite Element Simulation; Network model;
D O I：
暂无
中图分类号：
X [环境科学、安全科学];
学科分类号：
08 ; 0830 ;
摘要：
The aim of this article is to build an analytic thermal resistance of the heat sink used for high led power. The thermal model is defined in order to predict the mean temperature of the heat source of the LED by establishing a network model based on heat flux flow distribution. The thermal model is developed by finding a relationship between the heat sink resistance and their geometry; wish is implemented in SIMULINKIM. The results of the model are comparing with 3D finite element simulation by COMSOL in order to validate the model proposed.
引用
收藏
页码：278 / 280
页数：3
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