Automatic Solder Joint Inspection System Based on X-ray Computer Vision

被引：0
|
作者：
Han Yueping [1 ]
Li Ruihong [2 ]
Han Yan [1 ]
机构：
[1] N Univ China, Sci & Technol Elect Test & Measurement Lab, Taiyuan 030051, Peoples R China
[2] N Univ China, Minist Educ, Key Lab Instrument Sci & Dynam Measurement, Taiyuan 030051, Peoples R China
来源：
2011 INTERNATIONAL CONFERENCE ON MACHINE INTELLIGENCE (ICMI 2011), PT 2 | 2011年 / 4卷
关键词：
Solder joint inspection; X-ray vision; difference image; cross correlation matching;
D O I：
暂无
中图分类号：
TP18 [人工智能理论];
学科分类号：
081104 ; 0812 ; 0835 ; 1405 ;
摘要：
An automated X-ray computer vision system in which a number of image processing algorithms are embedded is proposed for visually inspecting the solder joints of both traditional printed circuit board and even microcircuit. Firstly, image preprocessing is done using one fast noise reduction approach based on partitioning processing. Secondly, difference image method in used to carry out the exterior inspection. Finally, image cross correlation matching is executed by extracting the interested features of the solder joints that contain local and structural information The simulations on real PCB gray images demonstrate that this method is robust enough to detect any missing components and cut solder joint with any size and shape with significant reduction in computational time compared to conventional approach.
引用
收藏
页码：70 / +
页数：2
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