A Literature Review on Sampling Techniques in Semiconductor Manufacturing

被引：35

作者：

Nduhura-Munga, Justin ^{[1
,2
]}

Rodriguez-Verjan, Gloria ^{[1
,3
]}

Dauzere-Peres, Stephane ^{[1
]}

Yugma, Claude ^{[1
]}

Vialletelle, Philippe ^{[2
]}

Pinaton, Jacques ^{[3
]}

机构：

[1] Ecole Mines St Etienne, Ctr Microelect Provence, F-13541 Gardanne, France

[2] STMicroelect Crolles, F-38926 Crolles, France

[3] STMicroelect Rousset, F-13106 Rousset, France

来源：

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING | 2013年 / 26卷 / 02期

关键词：

Control; sampling; semiconductor; DEFECT; METHODOLOGY; REDUCTION; STRATEGY; DESIGN; MODEL;

D O I：

10.1109/TSM.2013.2256943

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

This paper reviews sampling techniques for inspection in semiconductor manufacturing. We discuss the strengths and weaknesses of techniques developed in the last last 20 years for excursion monitoring (when a process or machine falls out of specifications) and control. Sampling techniques are classified into three main groups: static, adaptive, and dynamic. For each group, a classification is performed per year, approach, and industrial deployment. A comparison between the groups indicates a complementarity strongly linked to the semiconductor environment. Benefits and drawbacks of each group are discussed, showing significant improvements from static to dynamic through adaptive sampling techniques. Dynamic sampling seems to be more appropriate for modern semiconductor plants.

引用

页码：188 / 195

页数：8

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