Silicon photonic on-chip optical interconnection networks

被引:3
|
作者
Bergman, Keren [1 ]
机构
[1] Columbia Univ, Dept Elect Engn, New York, NY 10027 USA
关键词
D O I
10.1109/LEOS.2007.4382483
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The recent emergence of multicore processor architectures is challenging the on-chip and inter-node communications infrastructure. We present the design of a silicon photonic network-on-chip that can deliver a high-bandwidth, low-latency, and power efficient scalable solution for future chip multiprocessors.
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页码:470 / 471
页数:2
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