Stress and Temperature Simulation Using Copper-Diamond Composite Slug

被引：1

作者：

Sauli, Zaliman ^{[1
]}

Retnasamy, Vithyacharan ^{[1
]}

Vairavan, Rajendaran ^{[1
]}

Ismail, Rizalafande Che ^{[1
]}

Khalid, Nazuhusna ^{[1
]}

Husin, Mohd Fikri Che ^{[1
]}

Kamarudin, Hussin ^{[1
]}

机构：

[1] Univ Malaysia Perlis, Sch Microelect Engn, Arau 02600, Perlis, Malaysia

来源：

UKSIM-AMSS 15TH INTERNATIONAL CONFERENCE ON COMPUTER MODELLING AND SIMULATION (UKSIM 2013) | 2013年

关键词：

single chip LED; copper diamond heat slug; ansys; junction temperature; THERMAL PERFORMANCE; POWER; DEGRADATION; DESIGN;

D O I：

10.1109/UKSim.2013.151

中图分类号：

TP301 [理论、方法];

学科分类号：

081202 ;

摘要：

A revolution to illumination industry, the high power light emitting diodes, LEDs have significant dominance in terms of optical performance, low power consumption and superior reliability over conventional lights. In spite of that the junction temperature of the LED is an imperative aspect which manipulates the consistency of the LED. This study discusses the thermal and stress analysis of single chip LED package with copper diamond heat slug. The simulation was carried out using Ansys version 11. In this simulation, input power of 0.1W and 1W were applied to the LED chip. The key findings of this study exhibited that the max junction temperature of 113.13 degrees C and stress of 116.36 MPa were gained.

引用

页码：299 / 303

页数：5

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