Recent Progress of Thermal Interface Materials

被引：14

作者：

Liu, Johan ^{[1
,2
,3
]}

Wang, Teng ^{[1
]}

Carlberg, Bjorn ^{[1
]}

Inoue, Masahiro ^{[4
]}

机构：

[1] Chalmers Univ Technol, Dept Microtechnol & Nanosci, Bionano Syst Lab, SMIT Ctr, Kemivagen 9, SE-41296 Gothenburg, Sweden

[2] Shanghai Univ, Key Lab Adv Display & Syst Applicat, Shanghai 200072, Peoples R China

[3] Shanghai Univ, SMIT Ctr, Sch Automat & Mech Engn, Shanghai 200072, Peoples R China

[4] Osaka Univ, Inst Sci & Ind Res, Ibaraki, Osaka 5670047, Japan

来源：

ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS | 2008年

关键词：

D O I：

10.1109/ESTC.2008.4684374

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

This paper reviews the status and recent progress achieved in the research of thermal interface materials (TIMs). The focus is on the research work performed in academia. The research and development work carried out in industry is also generally introduced. The existing TIM technologies have been categorized into eight main types and comprehensively analyzed. The state-of-the-art-research is then summarized and discussed with an emphasis on the carbon-filled materials. Other aspects of the TIM-related research, including theoretical study, modeling work, and characterization etc., are also briefly covered.

引用

页码：351 / +

页数：4

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