Isoconversional Method for the Modeling of the Curing Kinetics of Epoxy Molding Compounds for Mold Process Simulation

被引：0
|
作者：
Deak, Tamas [1 ]
Kazmer, David O. [2 ]
机构：
[1] Philips Lighting Hungary Kft, Budapest, Hungary
[2] Univ Massachusetts, Plast Engn Dept, Lowell, MA USA
来源：
2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) | 2018年
关键词：
RESINS;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A characterization and modeling protocol is presented for the measurement and calculus of curing kinetics of epoxy molding compounds to predict the degree of curing under arbitrary thermal conditions. The isoconversional approach allows the use of nonisothermal differential scanning calorimetry (DSC) data and obviates the disadvantage of isothermal experiments such as curing and heat generation that is unrecorded during the initial temperature ramp. The described model free kinetics (MFK) method enables the construction of isothermal curing curves without actually performing isothermal measurements, while at the same time verifying the correct value of activation energy. The presented methodology can be applied with the simplest means, without the need for specialized software. Application of the described protocol to epoxy molding compounds provided estimation of the Kamal-Sourour model coefficients having a coefficient of determination of 0.998.
引用
收藏
页码：337 / 344
页数：8
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