A Comparison of Lock-in Thermography and Magnetic Current Imaging for Localizing Buried Short-Circuits

被引：0
|
作者：
Vallett, David P. [1 ]
机构：
[1] IBM Syst & Technol Grp, Essex Jct, VT USA
来源：
ISTFA 2011: CONFERENCE PROCEEDINGS FROM THE 37TH INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS | 2011年
关键词：
D O I：
暂无
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The relative effectiveness of lock-in thermography and magnetic current imaging for identifying defects in packaged ICs was studied by directly comparing results on the same three devices. One known (in-lab fabricated) and two unknown (field return) defects were studied in organic flip-chip and wirebond configurations. Both methods succeeded in identifying the defective area but significant differences were observed in the qualitative nature of the signals, XY localization resolution, and sensitivity. Depth estimates were obtained where possible which aided in localization.
引用
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页码：146 / 152
页数：7
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