Embedded Toroidal Magnetic Coupling Probe in Multi-layer PCBs for Current Measurement

被引:0
|
作者
Kim, Jonghoon J. [1 ]
Kim, Heegon [1 ]
Kong, Sunkyu [1 ]
Jung, Daniel H. [1 ]
Kim, Joungho [1 ]
Kim, Jiseong [1 ]
Sung, Hajin [2 ]
机构
[1] Korea Adv Inst Sci & Technol, Dept Elect Engn, Taejon 305701, South Korea
[2] Minist Knowledge Econ, Dept Energy Efficiency, Gwacheon, South Korea
关键词
current probing; inductive coupling; signal reconstruction;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The importance of current detection has been highlighted with the introduction of 3D-IC, in order to ensure the safe and reliable operation of analog circuits in mixed-signal systems. In this paper, we propose toroidal current probe embedded in multi-layer printed circuit boards (PCBs) for current detection. Current is magnetically coupled to the proposed current probe and the transfer impedance between the port of injected current and the proposed current probe is used for the analysis of current coupling and current reconstruction. Through time-and frequency-domain experimental measurements with test vehicles on multilayer PCBs, we verified that the proposed current probe can accurately detect current signals. The proposed current probe does not influence the original current path, yet achieves high accuracy with a compact size by using a toroidal array of vias that surrounds the current path.
引用
收藏
页码:153 / 156
页数:4
相关论文
共 50 条
  • [21] Thickness measurement of multi-layer conductive coatings using multifrequency eddy current techniques
    Zhang, Dejun
    Yu, Yating
    Lai, Chao
    Tian, Guiyun
    NONDESTRUCTIVE TESTING AND EVALUATION, 2016, 31 (03) : 191 - 208
  • [22] Multi-layer self-integrating Rogowski coils for high pulsed current measurement
    I. A. Metwally
    Instruments and Experimental Techniques, 2015, 58 : 49 - 58
  • [23] Multi-layer self-integrating Rogowski coils for high pulsed current measurement
    Metwally, I. A.
    INSTRUMENTS AND EXPERIMENTAL TECHNIQUES, 2015, 58 (01) : 49 - 58
  • [24] Power Integrity Concepts for High-Speed Design on Multi-Layer PCBs
    Hwang, Chulsoon
    2018 IEEE SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, SIGNAL INTEGRITY AND POWER INTEGRITY (EMC, SI & PI), 2018,
  • [25] Photothermal characterization of multi-layer magnetic materials
    Wang, ZQ
    Newman, DM
    Carey, R
    IEEE TRANSACTIONS ON MAGNETICS, 2000, 36 (05) : 3640 - 3642
  • [26] Effect of Capacitance on Eddy-Current Loss in Multi-Layer Magnetic Films for MHz Magnetic Components
    Yao, Di
    Sullivan, Charles R.
    2009 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION, VOLS 1-6, 2009, : 526 - 532
  • [27] Multi-Layer Magnetic Focusing Sensor Structure for Pulsed Remote Field Eddy Current
    Yang, Changrong
    Gao, Bin
    Ma, Qiuping
    Xie, Lian
    Tian, Gui Yun
    Yin, Ying
    IEEE SENSORS JOURNAL, 2019, 19 (07) : 2490 - 2499
  • [28] An optical method of contactless measurement of giant magnetoresistance effects in magnetic multi-layer films
    State Key Laboratory of Electronic Thin Films and Integrated Devices, University of Electronic Science and Technology of China, Chengdu 610054, China
    不详
    Dianzi Keji Diaxue Xuebao, 2007, 4 (657-659):
  • [29] Photothermal characterization of multi-layer magnetic materials
    Zhao Qiu Wang
    Newman, D.M.
    Carey, R.
    IEEE Transactions on Magnetics, 2000, 36 (5 I) : 3640 - 3642
  • [30] Early time charge replenishment of the power delivery network in multi-layer PCBs
    Selli, G.
    Cocchini, M.
    Knighten, J. L.
    Archambeault, B.
    Fan, J.
    Connor, S. R.
    Orlandi, A.
    Drewniak, J. L.
    2007 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY: WORKSHOP AND TUTORIAL NOTES, VOLS 1-3, 2007, : 504 - +