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- [1] Design of Toroidal Current Probe Embedded in Multi-layer Printed Circuit Boards for Electrostatic Discharge(ESD) Detection 2010 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGE & SYSTEMS SYMPOSIUM, 2010,
- [2] FABRICATION OF MULTI-LAYER WINDINGS IN SILICON-EMBEDDED TOROIDAL INDUCTORS 2015 TRANSDUCERS - 2015 18TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS (TRANSDUCERS), 2015, : 610 - 613
- [3] Characterization of SSN coupling to signal via in multi-layer PCBs and packages 2006 17TH INTERNATIONAL ZURICH SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1 AND 2, 2006, : 328 - +
- [4] Ground starvation effects on multi-layer PCBs 2000 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1 AND 2, SYMPOSIUM RECORD, 2000, : 113 - 116
- [5] Eddy Current Testing in Thickness Measurement of Material with Multi-layer Structure CCDC 2009: 21ST CHINESE CONTROL AND DECISION CONFERENCE, VOLS 1-6, PROCEEDINGS, 2009, : 2065 - 2068
- [6] Reducing the emission of multi-layer PCBs by removing the supply plane ELECTROMAGNETIC COMPATIBILITY 1999, 1999, : 639 - 644
- [7] MAGNETIC FIELD OF MULTI-LAYER COILS CESKOSLOVENSKY CASOPIS PRO FYSIKU SEKCE A, 1969, 19 (06): : 641 - &
- [8] Multi-layer composites with reactive coupling agents Kunststoffe Plast Europe, 2000, 90 (04): : 18 - 20
- [9] Power Integrity Concepts for High Speed Design on Multi-Layer PCBs 2017 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY & SIGNAL/POWER INTEGRITY (EMCSI), 2017,
- [10] Magnetic Current Source Using Metamaterial Composed of Multi-Layer Ceramic Capacitors 2015 INTERNATIONAL WORKSHOP ON ANTENNA TECHNOLOGY (IWAT), 2015, : 11 - 12