共 50 条
- [35] Numerical simulation of hot embossing for polymer microfluidic chips CMESM 2006: Proceedings of the 1st International Conference on Enhancement and Promotion of Computational Methods in Engineering Science and Mechanics, 2006, : 299 - 304
- [36] AN EVALUATION STUDY OF ULTRASONIC FACE BONDING OF INTEGRATED CIRCUIT CHIPS TO EVAPORATED ALUMINUM CONDUCTORS PROCEEDINGS ELECTRONIC COMPONENTS CONFERENCE, 1968, (MAY): : 427 - &
- [38] Study of microchannel deformation of polymer microfluidic chip by in-mold bonding Zhongnan Daxue Xuebao (Ziran Kexue Ban)/Journal of Central South University (Science and Technology), 2013, 44 (12): : 4833 - 4839
- [39] The effect of injection molding PMMA microfluidic chips thickness uniformity on the thermal bonding ratio of chips Microsystem Technologies, 2012, 18 : 815 - 822
- [40] The effect of injection molding PMMA microfluidic chips thickness uniformity on the thermal bonding ratio of chips MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2012, 18 (06): : 815 - 822