Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review

被引：24

作者：

Ramli, Mohd Izrul Izwan ^{[1
,2
]}

Salleh, Mohd Arif Anuar Mohd ^{[1
,2
]}

Abdullah, Mohd Mustafa Al Bakri ^{[1
,2
]}

Zaimi, Nur Syahirah Mohamad ^{[1
,2
]}

Sandu, Andrei Victor ^{[3
,4
,5
]}

Vizureanu, Petrica ^{[3
,4
]}

Rylski, Adam ^{[6
]}

Amli, Siti Farahnabilah Muhd ^{[1
,2
]}

机构：

[1] Univ Malaysia Perlis, Fac Chem Engn Technol, Kangar 02600, Malaysia

[2] Univ Malaysia Perlis, Geopolymer & Green Technol Ctr Excellence, Kangar 02600, Malaysia

[3] Gheorghe Asachi Tech Univ Iasi, Fac Mat Sci & Engn, Mangeron 41, Iasi 700050, Romania

[4] Romanian Inventors Forum, St P Movila 3, Iasi 700089, Romania

[5] Natl Inst Res & Dev Environm Protect INCDPM, Splaiul Independentei 294, Bucharest 060031, Romania

[6] Lodz Univ Technol, Inst Mat Sci & Engn, Fac Mech Engn, Stefanowskiego 1-15, PL-90924 Lodz, Poland

来源：

MATERIALS | 2022年 / 15卷 / 04期

关键词：

intermetallic compound; alloying; surface finish; solder alloy; SN-AG-CU; MECHANICAL-PROPERTIES; INTERFACIAL REACTIONS; SHEAR-STRENGTH; SURFACE FINISH; NI ADDITIONS; IMC GROWTH; SN-3.0AG-0.5CU SOLDER; SN-3.8AG-0.7CU SOLDER; PRIMARY CU6SN5;

D O I：

10.3390/ma15041451

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Recently, research into the factors that influence the formation and growth of intermetallic compounds (IMCs) layer in lead-free solders has piqued interest, as IMCs play an important role in solder joints. The reliability of solder joints is critical to the long-term performance of electronic products. One of the most important factors which are known to influence solder joint reliability is the intermetallic compound (IMC) layer formed between the solder and the substrate. Although the formation of an IMC layer signifies good bonding between the solder and substrate, its main disadvantage is due to its brittle nature. This paper reviews the formation and growth of IMCs in lead-free solder joints detailing the effect of alloying additions, surface finishes, aging time, aging temperature and solder volume. The formation and growth of the brittle IMCs were significantly affected by these factors and could be possibly controlled. This review may be used as a basis in understanding the major factors effecting the IMC formation and growth and relating it to the reliability of solder joints.

引用

页数：20

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