Development of Novel Conditioning Method Using Thermal Shape Memory Characteristics of Polyurethane CMP Pad

被引:0
|
作者
Seo, Jangwon [1 ,2 ]
Jeon, Sanghuck [1 ]
Yoon, Jongwook [2 ]
An, Joonho [2 ]
Choi, Yongsoo [2 ]
Seok, Hyunho [3 ]
Lee, Seunghwan [1 ]
Liu, Pengzhan [1 ]
Jeon, Wookyung [1 ]
Kim, Taesung [1 ,3 ]
机构
[1] Sungkyunkwan Univ SKKU, Sch Mech Engn, Suwon 16419, Gyeonggi Do, South Korea
[2] SK Enpulse, Tech Ctr, Suwon 16338, Gyeonggi Do, South Korea
[3] Sungkyunkwan Univ SKKU, SKKU Adv Inst Nano Technol SAINT, Suwon 16419, Gyeonggi Do, South Korea
关键词
chemical mechanical planarization; asperity; conditioning; shape memory; CMP pad; MATERIAL REMOVAL RATE; SCRATCH FORMATION; PERFORMANCE; MECHANISM; DEBRIS; FORCE; SIZE;
D O I
10.1149/2162-8777/ad2cfc
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Traditionally, the pad roughness has been maintained by wearing down the polyurethane pad with diamond disk. However, that method generates debris and reduces pad lifetime. This study propose a new approach to pad surface recovery by synthesizing a polyurethane-based raw material that exhibits shape memory behavior and can recover its shape upon heating. The findings suggest that the pad's surface can be maintained by utilizing its shape memory trait and designing a system to heat the pad. The pad recovery tests were conducted using universal test machine (UTM) samples and found that, in terms of heat recovery, increasing the temperature had a greater effect than increasing the exposure time. CMP test was performed by using three conditioning potions: diamond disk conditioning, heat conditioning, and no conditioning. The results showed that pad asperity was recovered more efficiently with heat conditioning than with no conditioning (demonstrated by a 19% higher removal rate). The experimental results can be expected that combines diamond disk conditioning with heat conditioning could be a superior alternative for pad surface refreshment. Shape memory pads can return to their original form, leading to better chemical mechanical planarization (CMP) performance and an extended pad lifetime.
引用
收藏
页数:9
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