The signed helical angle: A technique for characterizing midfoot motion during gait

被引:1
|
作者
Bassett, Kirk E. [1 ]
Charles, Steven K. [1 ]
Bruening, Dustin A. [2 ]
机构
[1] Brigham Young Univ, Mech Engn Dept, Provo, UT USA
[2] Brigham Young Univ, Exercise Sci Dept, Provo, UT 84602 USA
基金
美国国家科学基金会;
关键词
Foot Mechanics; Midtarsal; Finite Helical Axis; Axis-angle; JOINT COORDINATE SYSTEM; FOOT; REPRESENTATION; KINEMATICS; ANKLE; AXIS;
D O I
10.1016/j.jbiomech.2023.111791
中图分类号
Q6 [生物物理学];
学科分类号
071011 ;
摘要
Quantifying motion in the midfoot during gait and other movements is important for a variety of applications, but challenging due to the complexity of the multiple small articulations involved. The most common motion capture based techniques are limited in their ability to characterize the non-planar nature of the midfoot joint axes. In this study we developed a novel Signed Helical Angle (SHA) to quantify midfoot angular displacement. Motion capture data from 40 healthy subjects walking at a controlled speed were used to calculate finite helical axes and angles from a two-segment foot model. Axes were classified as either pronation or supination based on their orientation, and given a sign, thus either adding to or subtracting from the angular displacement. Analysis focused on insights from axis orientation and comparisons to other techniques. Results showed that when transitions were excluded, pronation and supination axes were fairly well clustered in the transverse plane. The resulting SHA midfoot angle waveform was comparable to sagittal plane Euler and helical component waveforms, but with 39% (approximately 3 degrees) greater range of motion in pronation and 25% (approximately 4 degrees) greater in supination, due to the direct measurement of the motion path and the influence of the other planes. The proposed SHA method may provide an intuitive and useful method to analyze midfoot motion for a variety of applications, particularly when interventions cause subtle changes that may be diluted in planar analyses.
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页数:5
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