Influence of conversion on dielectric constant of Dicyandiamide cured epoxy resin:a molecular dynamic simulation and experiment study

被引:3
|
作者
Zhang, Dujuan [1 ,2 ]
Li, Yafeng [1 ,2 ]
Lu, Haijun [1 ,2 ]
Zhao, Fugui [3 ]
Cheng, Jue [3 ]
Zhang, Junying [3 ]
机构
[1] AVIC Beijing Aeronaut Mfg Technol Res Inst, Composite Technol Ctr, Beijing 101300, Peoples R China
[2] Beijing Inst Aeronaut Mat, Key Lab Adv Composites, Beijing 100095, Peoples R China
[3] Beijing Univ Chem Technol, Key Lab Carbon Fiber & Funct Polymers, Minist Educ, Beijing 100029, Peoples R China
关键词
Epoxy resin; Dielectric constant; Molecular dynamic simulation; POLYMERS;
D O I
10.1016/j.polymer.2022.125645
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
In this study, molecular dynamic simulation and experiment study are combined to explore the main control factors of dielectric constant of Dicyandiamide cured epoxy resin. The density and glass transition temperature obtained by experiment and simulation were compared to verify the rationality of simulation models. Then dielectric constant was calculated by dipole fluctuation formula, here motion mobility, polarity, and free volume were employed to interpret the influence mechanism of conversion on dielectric constant. Results indicate that before gelation the dielectric constant is controlled by the content of unreacted monomers especially dicyan-diamide, and after gelation it is dominated by the segmental mobility, hydroxyl group density and free volume, where the influence of segmental mobility is more significant than that of free volume and hydroxyl group density.
引用
收藏
页数:7
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