Degradation Mechanisms of Gate Leakage in GaN-Based HEMTs at Low Dose Rate Irradiation

被引:1
|
作者
Li, Xiaolong [1 ]
Wang, Xin [1 ]
Liu, Mohan [1 ]
Zhu, Kunfeng [2 ]
Shui, Guohua [2 ]
Zheng, Qiwen [1 ]
Cui, Jiangwei [1 ]
Lu, Wu [1 ]
Li, Yudong [1 ]
Guo, Qi [1 ]
机构
[1] Chinese Acad Sci, Xinjiang Tech Inst Phys & Chem, Key Lab Funct Mat & Devices Special Environm, Urumqi 830011, Peoples R China
[2] Sci & Technol Analog Integrated Circuit Lab, Chongqing 400000, Peoples R China
来源
IEEE ACCESS | 2024年 / 12卷
基金
中国国家自然科学基金;
关键词
Logic gates; HEMTs; MODFETs; Radiation effects; Degradation; Transconductance; Gate leakage; Gallium nitride; Leakage currents; p-GaN high-electron-mobility transistor (HEMT); low dose rate irradiation; gate leakage; ALGAN/GAN; DEPENDENCE;
D O I
10.1109/ACCESS.2024.3368870
中图分类号
TP [自动化技术、计算机技术];
学科分类号
0812 ;
摘要
In this paper, we investigated an experimental analysis of the degradation caused by low dose rate irradiation in GaN-based high-electron-mobility transistors (HEMTs) with a p-type gate. Combined with experimental frequency-dependent conductance ( G(p)/omega) analyses and TCAD simulations, it has been demonstrated that the negative shifts in both I-d - V-gs and V-th are primarily due to the formation of donor-like traps near the p-GaN/AlGaN interface, which is a result of the dehydrogenation of pre-existing defects during low dose rate irradiation. Additionally, the results of the TCAD simulations, indicate that the trap-assisted tunneling (TAT) process, which involves the recombination of trap-assisted holes with electrons in the p-GaN layer, may dominate the physical mechanisms responsible for the increase in gate leakage current ( I-g -V-gs ). These results may provide a basis for understanding the role of radiation-induced traps on electrical parameters degradations for p-GaN gate HEMTs.
引用
收藏
页码:35410 / 35416
页数:7
相关论文
共 50 条
  • [41] Trapping mechanisms in GaN-based MIS-HEMTs grown on silicon substrate
    Bisi, Davide
    Meneghini, Matteo
    Van Hove, Marleen
    Marcon, Denis
    Stoffels, Steve
    Wu, Tian-Li
    Decoutere, Stefaan
    Meneghesso, Gaudenzio
    Zanoni, Enrico
    PHYSICA STATUS SOLIDI A-APPLICATIONS AND MATERIALS SCIENCE, 2015, 212 (05): : 1122 - 1129
  • [42] Reduction of On-Resistance in Ion-Implanted GaN/AlGaN/GaN HEMTs with Low Gate Leakage Current
    Nomoto, Kazuki
    Satoh, Masataka
    Nakamura, Tohru
    ELECTRONICS AND COMMUNICATIONS IN JAPAN, 2010, 93 (06) : 19 - 24
  • [43] Excess gate leakage at low voltage in InP-based HEMTs
    Maher, H
    Scavennec, A
    Décobert, J
    Post, G
    2000 INTERNATIONAL CONFERENCE ON INDIUM PHOSPHIDE AND RELATED MATERIALS, CONFERENCE PROCEEDINGS, 2000, : 83 - 86
  • [44] Lifetesting GaN HEMTs With Multiple Degradation Mechanisms
    Paine, Bruce M.
    Polmanter, Steve R.
    Ng, Vincent T.
    Kubota, Neil T.
    Ignacio, Carl R.
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2015, 15 (04) : 486 - 494
  • [45] Degradation mechanisms of AlGaN/GaN HEMTs under 800 MeV Bi ions irradiation
    Lei, Z. F.
    Guo, H. X.
    Tang, M. H.
    Zeng, C.
    Zhang, Z. G.
    Chen, H.
    En, Y. F.
    Huang, Y.
    Chen, Y. Q.
    Peng, C.
    MICROELECTRONICS RELIABILITY, 2018, 80 : 312 - 316
  • [46] Total-Ionizing-Dose Responses of GaN-Based HEMTs With Different Channel Thicknesses and MOSHEMTs With Epitaxial MgCaO as Gate Dielectric
    Bhuiyan, Maruf A.
    Zhou, Hong
    Chang, Sung-Jae
    Lou, Xiabing
    Gong, Xian
    Jiang, Rong
    Gong, Huiqi
    Zhang, En Xia
    Won, Chul-Ho
    Lim, Jong-Won
    Lee, Jung-Hee
    Gordon, Roy G.
    Reed, Robert A.
    Fleetwood, Daniel M.
    Ye, Peide
    Ma, Tso-Ping
    IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2018, 65 (01) : 46 - 52
  • [47] Field- and current-driven degradation of GaN-based power HEMTs with p-GaN gate: Dependence on Mg-doping level
    Rossetto, I.
    Meneghini, M.
    Canato, E.
    Barbato, M.
    Stoffels, S.
    Posthuma, N.
    Decoutere, S.
    Tallarico, A. N.
    Meneghesso, G.
    Zanoni, E.
    MICROELECTRONICS RELIABILITY, 2017, 76 : 298 - 303
  • [48] Material and device issues of GaN-based HEMTs
    Kordos, P
    Alam, A
    Betko, J
    Chow, PP
    Heuken, M
    Javorka, P
    Kocan, M
    Marso, M
    Morvic, M
    Van Hove, JM
    8TH IEEE INTERNATIONAL SYMPOSIUM ON HIGH PERFORMANCE ELECTRON DEVICES FOR MICROWAVE AND OPTOELECTRONIC APPLICATIONS, 2000, : 61 - 66
  • [49] A Monolithically Integrated GaN-Based Light Emitting Transistor with a High On/Off Ratio and Low Gate Leakage Current
    Kim, Jae Hun
    Yun, Ilgu
    ACS APPLIED ELECTRONIC MATERIALS, 2024, 6 (11) : 7876 - 7882
  • [50] Reverse gate leakage mechanism of AlGaN/GaN HEMTs with Au-free gate
    蒋鑫
    李晨浩
    羊硕雄
    梁家豪
    来龙坤
    董青杨
    黄威
    刘新宇
    罗卫军
    Chinese Physics B, 2023, (03) : 513 - 520