Cu2O p-type Thin-Film Transistors with Enhanced Switching Characteristics for CMOS Logic Circuit by Controlling Deposition Condition and Annealing in the N2 Atmosphere

被引:13
|
作者
Lee, Jae Hak [1 ,2 ]
Kim, Jiyeon [3 ]
Jin, Minho [1 ]
Na, Hyun-Jae [1 ,2 ]
Lee, Haeyeon [4 ,5 ]
Im, Changik [1 ]
Kim, Youn Sang [1 ,3 ,4 ,5 ,6 ]
机构
[1] Seoul Natl Univ, Grad Sch Convergence Sci & Technol, Program Nano Sci & Technol, Seoul 08826, South Korea
[2] Samsung Display Co Ltd, Yongin 17113, South Korea
[3] Seoul Natl Univ, Grad Sch Convergence Sci & Technol, Dept Appl Bioengn, Seoul 08826, South Korea
[4] Seoul Natl Univ, Coll Engn, Dept Chem & Biol Engn, Seoul 08826, South Korea
[5] Seoul Natl Univ, Inst Chem Proc, Coll Engn, Seoul 08826, South Korea
[6] Adv Inst Convergence Technol, Suwon 16229, South Korea
基金
新加坡国家研究基金会;
关键词
p-type metal oxide; Cu2O TFT; dissociative copper; copper oxide; metal oxide CMOS inverter; LOW-TEMPERATURE; OXIDE; FABRICATION; DESIGN;
D O I
10.1021/acsaelm.2c01589
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Cuprous oxide (Cu2O) p-type thin-film transistors (TFTs) can be practically applied for complementary metal oxide semiconductor (CMOS) logic circuits, but the electrical perform-ances are still insufficient due to high off-current and low field-effect mobility. Here, we have demonstrated Cu2O TFTs with improved field-effect mobility and low off-current through reduction of cupric oxide (CuO) impurities and dissociative Cu defects with the combination of deposition and annealing conditions. Copper oxide was deposited by radio frequency sputtering in mixed gases of argon and oxygen. After that, the deposited copper oxide was annealed at 800 degrees C in the tube furnace under a N-2 atmosphere instead of a high vacuum condition. The fabricated Cu2O thin film had a high crystalline quality, the ratio of dissociative Cu defects decreased from 11.3 to 3.1%, and the electrical performances of the TFT including the fabricated Cu2O thin film exhibited the field-effect mobility of 1.11 +/- 0.05 cm(2)/V center dot s, the on/off current ratio of 4.68 +/- 0.8 x 104, and the subthreshold swing value of 3.91 +/- 0.21 V dec(-1). The fabricated Cu2O TFT showed a Vth shift of 3.31 V in the transfer curve under negative bias stress. Nitrogen plays a role in promoting Cu2O phase formation while it prevents CuO phase formation during the annealing process. In addition, oxygen added during sputtering increases the ratio of CuO in the copper oxide thin film and works effectively to reduce dissociative Cu defects in the annealing process. To determine the feasibility of the CMOS logic circuit, we also demonstrated the inverter with n-type indium-gallium-zinc oxide (IGZO) TFT and p-type Cu2O TFT, which showed a voltage gain of 14 at V-DD = 20 V.
引用
收藏
页码:1123 / 1130
页数:8
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