A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

被引：5
|
作者：
Li, Yilin [1 ]
Yu, Shuyuan [2 ]
Li, Liangwei [1 ]
Song, Shijie [1 ]
Qin, Weiou [1 ]
Qi, Da [1 ]
Yang, Wenchao [1 ]
Zhan, Yongzhong [1 ]
机构：
[1] Guangxi Univ, Sch Resources, State Key Lab Featured Met Mat & Life Cycle Safety, MOE Key Lab New Proc Technol Nonferrous Met & Mat, Nanning 530004, Peoples R China
[2] Shenzhen Customs Ind Prod Testing Technol Ctr, Shenzhen 518067, Peoples R China
来源：
METALS | 2023年 / 13卷 / 07期
基金：
中国国家自然科学基金;
关键词：
graphene; lead-free solder; particle reinforcement; composite solder; strengthening mechanisms; preparation method; INTERMETALLIC COMPOUND GROWTH; AG-CU SOLDERS; MECHANICAL-PROPERTIES; NANOSHEETS ADDITION; INTERFACE REACTION; SHEAR-STRENGTH; MICROSTRUCTURE; WETTABILITY; PERFORMANCE; JOINTS;
D O I：
10.3390/met13071209
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In the electronics industry, graphene is applied with modified lead-free solder. This review presents advances in the preparation, strengthening mechanisms, and property characterization of graphene composite solders. Graphene composite solders are divided into two main categories: unmodified graphene and metal-particle-modified graphene. The unmodified graphene composite solders are classified according to the different solder systems. Metal-particle-modified graphene composite solders are classified according to different metal particles. However, there are still challenges with graphene composite solders. The main challenge is the poor bonding of graphene to the substrate and the nonuniform dispersion. Future directions for the development of graphene composite solders are proposed. They can provide some reference for the development of new graphene composite solders in the future.
引用
收藏
页数：23
相关论文
共 50 条
  • [21] Electrochemical Migration Investigation on Lead-Free Sn-based Solder Alloys in 3.5 wt.% NaCl Solution
    Gharaibeh, Ali
    Rigler, Daniel
    Medgyes, Balint
    Harsanyi, Gabor
    [J]. 2022 45TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2022,
  • [22] Corrosion Behaviour of Sn-based Lead-Free Solders in Acidic Solution
    Nordarina, J.
    Mohd, H. Z.
    Ahmad, A. M.
    Muhammad, F. M. N.
    [J]. MALAYSIAN TECHNICAL UNIVERSITIES CONFERENCE ON ENGINEERING AND TECHNOLOGY 2017 (MUCET 2017), 2018, 318
  • [23] The effects of Bi substitution for Sn on mechanical properties of Sn-based lead-free solders
    Raza, Mehdi
    Shewchenko, Lee
    Olofinjana, Ayodele
    Kent, Damon
    Mata, Jitendra
    Haque, Rezwanul
    [J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 32 (17) : 22155 - 22167
  • [24] The effects of Bi substitution for Sn on mechanical properties of Sn-based lead-free solders
    Mehdi Raza
    Lee Shewchenko
    Ayodele Olofinjana
    Damon Kent
    Jitendra Mata
    Rezwanul Haque
    [J]. Journal of Materials Science: Materials in Electronics, 2021, 32 : 22155 - 22167
  • [25] Development of Sn-Zn-Al lead-free solder alloys
    Kitajima, M
    Shono, T
    [J]. FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 2005, 41 (02): : 225 - 235
  • [26] Development of Sn-Bi systems lead-free solder paste
    Li, Kangning
    Lei, Yongping
    Lin, Jian
    Liu, Baoquan
    Bai, Hailong
    Qin, Junhu
    [J]. 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 160 - +
  • [27] Wetting behaviour of lead-free Sn-based alloys on Cu and Ni substrates
    Amore, S.
    Ricci, E.
    Borzone, G.
    Novakovic, R.
    [J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2008, 495 (1-2): : 108 - 112
  • [28] Fatigue crack growth behavior of Sn-Pb and Sn-based lead-free solders
    Zhao, J
    Mutoh, Y
    Miyashita, Y
    Wang, L
    [J]. ENGINEERING FRACTURE MECHANICS, 2003, 70 (15) : 2187 - 2197
  • [29] Performance assessment of Sn-based lead-free solder composite joints based on extreme learning machine model tuned by Aquila optimizer
    Dele-Afolabi, T. T.
    Ahmadipour, Masoud
    Hanim, M. A. Azmah
    Oyekanmi, A. A.
    Ansari, M. N. M.
    Sikiru, Surajudeen
    Kumar, Niraj
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2024, 970
  • [30] The Measurement of Thermal Conductivity Variation with Temperature for Sn-Based Lead-Free Binary Solders
    Mustafa Demir
    Sezen Aksöz
    Esra Öztürk
    Necmettin Maraşlı
    [J]. Metallurgical and Materials Transactions B, 2014, 45 : 1739 - 1749
12345