Toward 4D Printing of Shape Memory Polymers Based on Polyaryletherketone/NVP/PEGDA through Molecular Engineering and Direct Ink Writing 3D Printing

被引:5
|
作者
Gao, Ketian [1 ,2 ]
Gong, Junhui [2 ,3 ]
Cao, Pengrui [2 ,3 ]
Tang, Zhangzhang [2 ,3 ]
Wang, Tingmei [2 ,3 ]
Tao, Liming [2 ,3 ]
Zhang, Xinrui [2 ,3 ]
Zhang, Jianqiang [1 ]
Wang, Qihua [2 ,3 ]
Zhang, Yaoming [2 ,3 ]
机构
[1] Lanzhou Univ Technol, Sch Petrochem Technol, Lanzhou 730050, Peoples R China
[2] Chinese Acad Sci, Lanzhou Inst Chem Phys, Key Lab Sci & Technol Wear & Protect Mat, Lanzhou 730000, Peoples R China
[3] Univ Chinese Acad Sci, Ctr Mat Sci & Optoelect Engn, Beijing 100049, Peoples R China
基金
中国国家自然科学基金;
关键词
shape memory polymer; polyaryletherketone; photocuring; 4D printing; solvent-free; MORPHOLOGY;
D O I
10.1021/acsapm.3c01020
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Polyaryletherketone (PAEK), an engineering plastic with exceptional mechanical properties and a high glass transition temperature, can be tailored with various properties to meet the multiple requirements of aerospace applications. However, it remains a challenge to 3D print PAEK with good properties. Herein, a direct ink writing (DIW) 3D printable PAEK ink has been developed, and the yielded PAEK parts possess high tensile strength and excellent shape memory properties. The incorporation of N-vinyl-2-pyrrolidone (NVP) and polyethylene glycol diacrylate PEGDA into PAEK oligomers (PAEKOs) facilitated their versatility as diluents or reactive functional monomers. This characteristic enabled random cross-linking through photoinitiator exposure for the formation of block copolymers, establishing the essential stationary and reversible phases needed for shape memory capabilities. The photocured PAEK demonstrated excellent comprehension performances, including an outstanding tensile strength (42.6 MPa), thermal stability (T-d-246 degrees C), shape fixation ratio (>93%), and shape recovery ratio (>100%). Furthermore, PAEK with a greater shape memory effect was utilized as an actuator to realize gripping and releasing at high temperatures (140 degrees C). This study therefore provides an emerging strategy to fabricate shape memory components for challenging environments using DIW technology. This approach also holds promise for implementation in systems beyond PAEK which have typically been difficult to print.
引用
收藏
页码:8833 / 8844
页数:12
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