Avoiding Plasma Damage: MacEtch enabled ß-Ga2O3 FinFETs for On-Resistance Reduction and Hysteresis Elimination

被引:0
|
作者
Huang, Hsien-Chih [1 ]
Ren, Zhongjie [2 ]
Bhuiyan, A. F. M. Anhar Uddin [3 ]
Feng, Zixuan
Luo, Xixi [2 ]
Huang, Alex Q. [2 ]
Zhao, Hongping [3 ]
Li, Xiuling [1 ,2 ]
机构
[1] Univ Illinois, Chicago, IL 60680 USA
[2] Univ Texas Austin, Austin, TX 78712 USA
[3] Ohio State Univ, Columbus, OH 43210 USA
关键词
beta-Ga2O3; MacEtch and; FinFET;
D O I
10.1109/EDTM55494.2023.10103115
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Although highly promising, the performance of beta Ga2O3 transistors are far from their theoretical potentials. Structural innovations by adopting the FinFET geometry remains a relatively virgin field for this material. Here we report the results and discuss the prospect of beta Ga2O3 FinFETs fabricated by the plasma-free highly anisotropic metal-assisted chemical etching (MacEtch) method. A specific onresistance (Ron,sp) of 6.5 mO center dot cm(2) and a 370 V breakdown voltage are achieved. The MacEtchformed FinFETs demonstrate near-zero (9.7 mV) hysteresis.
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页数:3
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