C-V measurement and modeling of double-BOX Trap-Rich SOI substrate

被引:3
|
作者
Huang, Yang [1 ]
Yan, Yiyi [2 ]
Nabet, Massinissa [2 ]
Liu, Fanyu [1 ]
Li, Bo [1 ]
Li, Binhong [1 ]
Han, Zhengsheng [1 ]
Nguyen, Bich-Yen [3 ]
Cristoloveanu, Sorin [4 ]
Raskin, Jean-Pierre [2 ]
机构
[1] Chinese Acad Sci, Univ Chinese Acad Sci, Inst Microelect, Key Lab Sci & Technol Silicon Devices, Beijing, Peoples R China
[2] Univ Catholique Louvain UCLouvain, ICTEAM, Leuven, Belgium
[3] SOITEC, Spring Valley, CA USA
[4] INP Grenoble, MINATEC, IMEP, Grenoble, France
关键词
Radio frequency; High resistivity silicon-on-insulator substrate; Polysilicon; Trap density; TCAD simulation; Hysteresis; SI;
D O I
10.1016/j.sse.2023.108763
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, we propose a new Double-BOX structure for the characterization of the electrical properties of the trap-rich layer used to improve the radio frequency performance of Silicon-on-Insulator substrates. Capacitance voltage (C-V) measurement is used in this investigation. The experiment reveals anomalous C-V behaviors with a plateau appearing in the electron accumulation region and a shift towards negative voltages in hysteresis. According to the TCAD simulation, it is found that both of them are caused by the deep trap states in the polysilicon near the front interface. Based on the C-V hysteresis, the density of the deep trap states can be determined from measurements.
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页数:5
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