Will Better Sintering Quality of Ag Nanoparticles Lead to More Reliable Ag Bonding Interfaces?

Ag sintering technology for die-attach application in power semiconductors has garnered significant attention in recent years due to its excellent high-temperature service reliability. In this study, a highly reliable bonding joint was achieved using a specific Ag paste, resulting in shear strength of 37.63 MPa after pressureless bonding at 250 & DEG;C for 10 min. However, a significant reduction in bonding strength was observed when using another set of Ag paste with better sintering performance. To investigate this anomalous phenomenon, we have performed a series of characterizations and proposed a corresponding bonding formation mechanism. The conclusions and inferences drawn from this study offer valuable theoretical support for the further application of Ag sintering, thereby promoting the advancement of this technology.