Dynamic and quasi-static mechanical behavior of 3D metallic woven lattices

被引:2
|
作者
Xue, Ju [1 ]
Lee, Hak Yong [2 ]
Hemker, Kevin J. [3 ,4 ]
Guest, James K. [2 ,3 ]
Weihs, Timothy P. [1 ,3 ]
机构
[1] Johns Hopkins Univ, Dept Mat Sci & Engn, Baltimore, MD 21218 USA
[2] Johns Hopkins Univ, Dept Civil & Syst Engn, Baltimore, MD 21218 USA
[3] Johns Hopkins Univ, Hopkins Extreme Mat Inst, Baltimore, MD 21218 USA
[4] Johns Hopkins Univ, Dept Mech Engn, Baltimore, MD 21218 USA
基金
美国国家科学基金会;
关键词
3D weaves; Mechanical properties; Architected materials; Damping; Lattice materials; DAMPING BEHAVIOR; CELLULAR METAL; ALLOY; FOAMS; COMPRESSION; FREQUENCY; AMPLITUDE;
D O I
10.1016/j.matdes.2023.111959
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Complex mechanical systems can generate severe dynamic environments that require materials with optimized combinations of damping properties, elastic moduli, and service temperatures. In this study, woven lattices were manufactured with stainless steel (SS) and copper (Cu) wires via a threedimensional (3D) weaving process to form SS, Cu, and SS-Cu lattices. Following fabrication, selective bonding using Cusil & REG; was applied to either one or both sides of the SS-Cu weaves to form single-sided bonded SS-Cu composite (B1C) lattices and double-sided bonded SS-Cu composite (B2C) lattices. Measurements of dynamic and quasi-static mechanical properties of both unbonded and bonded weaves demonstrate that all three unbonded lattices exhibit high loss factors with a relatively low normalized effective elastic modulus. In contrast, the bonded SS-Cu lattices exhibit lower loss factors but higher normalized effective elastic moduli. We attribute the high loss factors and relative low moduli to wire rearrangement during deformation in the form of wire sliding and rotation that becomes partially inhibited when we bond Cu wires on one or both sides of the SS-Cu weaves. We discuss sources for the observed variations in properties and demonstrate an ability to both tune and obtain exceptional damping and moderate stiffness in architected metallic lattices.& COPY; 2023 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
引用
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页数:13
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