Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors

被引：1

作者：

Zhang, Yunfan ^{[1
]}

Wu, Kangkang ^{[2
]}

Shen, Shengnan ^{[1
,2
]}

Zhang, Quanyong ^{[1
]}

Cao, Wan ^{[3
]}

Liu, Sheng ^{[1
,2
]}

机构：

[1] Wuhan Univ, Inst Technol Sci, Wuhan 430072, Peoples R China

[2] Wuhan Univ, Sch Power & Mech Engn, Wuhan 430072, Peoples R China

[3] Wuhan FineMEMS Inc, Wuhan 430075, Peoples R China

来源：

JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2023年 / 33卷 / 02期

基金：

国家重点研发计划;

关键词：

gold wire bonding; solder joint; thermal fatigue; FAILURE MECHANISMS; RELIABILITY;

D O I：

10.1088/1361-6439/aca913

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The failure of the gold wire bonding solder joint of a MEMS pressure sensor caused by the thermal cycling test was investigated with thermal cycling experiments and fatigue simulations. The results show that the maximum stress and strain occurred at the root of the solder joint on the substrate. With the accumulation of strain caused by thermal cycles, the bonding area of solder joint became smaller and the shear force of solder joints reduced to 22.3% after 1600 thermal cycles. The solder joints on the substrate failed after 1940 thermal cycles in plastic fatigue simulations and 3.16 x 10(8) thermal cycles in creep fatigue simulations. Plastic fatigue is the major factor for thermal failure of gold wire bonding.

引用

页数：8

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