Boosting Thermal Conductivity by Surface Plasmon Polaritons Propagating along a Thin Ti Film

被引:13
|
作者
Kim, Dong-min [1 ,2 ]
Choi, Sinwoo [1 ,2 ]
Cho, Jungwan [3 ]
Lim, Mikyung [4 ]
Lee, Bong Jae [1 ,2 ]
机构
[1] Korea Adv Inst Sci & Technol, Dept Mech Engn, Daejeon 34141, South Korea
[2] Korea Adv Inst Sci & Technol, Ctr Extreme Thermal Phys & Mfg, Daejeon 34141, South Korea
[3] Sungkyunkwan Univ, Sch Mech Engn, Suwon 16419, South Korea
[4] Korea Inst Machinery & Mat, Nanoconvergence Mfg Syst Res Div, Daejeon 34103, South Korea
基金
新加坡国家研究基金会;
关键词
RADIATIVE HEAT-TRANSFER; FIELD THERMOPHOTOVOLTAIC SYSTEM; SILICON;
D O I
10.1103/PhysRevLett.130.176302
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
We experimentally demonstrate boosted in-plane thermal conduction by surface plasmon polaritons (SPPs) propagating along a thin Ti film on a glass substrate. Due to the lossy nature of metal, SPPs can propagate over centimeter-scale distances even along a supported metal film, and the resulting ballistic heat conduction can be quantitatively validated. Further, for a 100-nm-thick Ti film on a glass substrate, a significant enhancement of in-plane thermal conductivity compared to bulk value (similar to 25%) is experimentally shown. This Letter will provide a new avenue to employ SPPs for heat dissipation along a supported thin film, which can be readily applied to mitigate hot-spot issues in microelectronics.
引用
收藏
页数:6
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