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- [23] Influence of copper nanowires on properties and microstructure of low-Ag Sn-1Ag-0.5Cu solders Journal of Materials Science: Materials in Electronics, 2022, 33 : 7923 - 7932
- [26] Interfacial microstructure, wettability and material properties of nickel (Ni) nanoparticle doped tin–bismuth–silver (Sn–Bi–Ag) solder on copper (Cu) substrate Journal of Materials Science: Materials in Electronics, 2016, 27 : 3982 - 3994
- [27] Microstructure, wetting characteristics and hardness of tin-bismuth-silver (Sn–Bi–Ag) solders on silver (Ag)-surface finished copper (Cu) substrates Journal of Materials Science: Materials in Electronics, 2017, 28 : 16921 - 16931
- [30] Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods Journal of Materials Science: Materials in Electronics, 2016, 27 : 6835 - 6844