Exact analysis of chemical reaction and thermal radiation effects on MHD Cu-water nanofluid flow past an infinite oscillatory vertical plate

被引:1
|
作者
Saikia, Dibya Jyoti [1 ]
Bordoloi, Rajdeep [1 ]
Ahmed, Nazibuddin [2 ]
机构
[1] Gauhati Univ, Dept Math, Gauhati 781014, India
[2] Cotton Univ, Dept Math, Gauhati, India
来源
MODERN PHYSICS LETTERS B | 2024年 / 38卷 / 20期
关键词
Nanofluid; radiation; chemical reaction; free convection; magnetohydrodynamics; MASS-TRANSFER; POROUS-MEDIUM;
D O I
10.1142/S0217984924501628
中图分类号
O59 [应用物理学];
学科分类号
摘要
The goal of this probing is to scrutinize the impact of chemical reaction and radiation on the flow behavior of a nanofluid, made up of copper nanoparticles suspended in water, as it moves through a vertically oscillating plate in a magnetohydrodynamic free, unsteady convective system. We tackled the problem with a mathematical model incorporating nanoparticle volume fraction and used a closed-form Laplace transformation method to resolve the governing equations for momentum, energy, and concentration field. The results were also depicted graphically with heat transport rate, mass transport rate, and skin friction illustrations. The study shows that increasing the volume fraction of Cu-water-based nanoparticles decreases primary and secondary velocities, while the temperature field grows. Moreover, a higher chemical reaction parameter leads to a drop in the fluid concentration. Furthermore, a graphic representation of the upshots of variant dimensionless parameters on the nanofluid velocity, temperature, and species concentration is provided. The subject of this paper explores an extension that involves the inclusion of Cu-water-based nanofluid. This nanofluid exhibits significantly higher thermal conductivity compared to typical fluids. Consequently, it can be considered a superior alternative to conventional fluids, proving to be valuable in enhancing heat transfer in diverse engineering and industrial processes. This study is significantly relevant to various industrial and machine-building applications.
引用
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页数:26
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